Research Needs for TSV-Based 3D IC Architectural Floorplanning
نویسندگان
چکیده
منابع مشابه
Research Needs for TSV-Based 3D IC Architectural Floorplanning
This article presents key research needs in three-dimensional integrated circuit (3D IC) architectural floorplanning. Architectural floorplaning is done at a very early stage of 3D IC design process, where the goal is to quickly evaluate architectural designs described in register-transfer level (RTL) in terms of power, performance, and reliability. This evaluation is then fed back to architect...
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Theoretical studies in the 1980s [1, 2] suggested that significant reductions in signal delay and power consumption could be achieved with 3D integrated circuits (3D ICs). A 3D IC is a chip that consists of multiple tiers of thinned-active 2D integrated circuits (2D ICs) that are stacked, bonded, and electrically connected with vertical vias formed through silicon or oxide layers and whose plac...
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In three dimensional integrated circuits (3D-ICs), through silicon via (TSV) is a critical technique in providing vertical connections. However, the yield and reliability is one of the key obstacles to adopt the TSV based 3D-ICs technology in industry. Various fault-tolerance structures using spare TSVs to repair faulty functional TSVs have been proposed in literature for yield and reliability ...
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this report shows the survey of reliability of 3D IC manufactory and its robustness. Firstly, we consider the reliability of the manufactory of 3D IC. The process-induced thermal stresses around TSVs raise serious reliability issues such as Si cracking and performance degradation of devices. Finite element analysis (FEA) combined with analytical methods is introduced to investigate this issue, ...
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In a stacked package, typically the bottom package is processor and the top pa of additional applications required by consumer industry, IC engineers add more features to their 2 generation processor and the memory performance is increased by faster communication to the processor. Test engineers need a sock seen many product offerings for this one level stacked socket. In order to move from 1 2...
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ژورنال
عنوان ژورنال: Journal of information and communication convergence engineering
سال: 2014
ISSN: 2234-8255
DOI: 10.6109/jicce.2014.12.1.046